示例機型：

HDL-8500/8510

應用領域Application：

適用于硅、陶瓷、玻璃、砷化鎵、磷化銦、各類引線框架/基板類封裝體的切割等材料的切割，全系列兼容6-12寸晶圓。

Blade saw applied for silicon, ceramic, gallium arsenide, and various materials like lead-frame and substrate, compatible with 6-12 inch wafer.

主要特點Main Features ： 

● 外觀尺寸追求小型化，占地面積小，切割行程大；

Miniaturized size and occupied area, but with huge working range;

● 配備NCS、BBD、漏液檢測模塊、遠程控制模塊，智能化、高效化適應客戶需求；

Equipped with NCS (Non-Contact Setup) block, BBD (blade break detect) block and weeping detecting block, adapt to customer's requirements intelligently and efficiently;

● 大功率主軸，高速高精度電機，大幅提高生產效率；

High power spindle, high speed & high precision motor, highly increase the yield;

● 高效的自動對準，自動刀痕識別以及崩邊檢測功能；

Efficient auto-focus, auto cutting line recognition and chipping detection function;

● 多種切割模式任意選擇，配有數據管理和日志管理系統，隨時監控生產狀況；

Switch to various cutting mode arbitrarily, with data management and log management system, easy to monitor the manufacture process at any time;

● 配備17英寸觸屏顯示器，呈現更多信息。

Equipped with 17 inch touch screen, getting more information during the working process.

主要參數 Main Parameters：

實例效果 Sample Effect：