示例機型：

DSI AG-09910

應用領域Application:

半導體行業晶圓表面缺陷檢測、CD量測和bump檢測

Wafer surface defect detection, bump detection in semiconductor industry.

主要特點Main Features:

● 5種放大倍率自動切換，可選配2X-20X物鏡；

5 kinds of magnification automatic switching, optional 2x-20x objective;

●支持明場&暗場照明缺陷檢測；

Support the detection of lighting defects in open field and dark field;

● 高分辨率，10X物鏡可檢出1.5um缺陷；

High resolution, 1.5um defect can be detected by 10x objective lens;

● 支持online/offline復查功能；

Support online / offline review function;

● 高速自動對焦，適應不同翹曲度的晶圓；

High speed auto focus, suitable for wafer with different warp age;

● 支持bare wafer 和 frame wafer檢測，兼顧后道流程；

Support bare wafer and frame wafer detection, and consider the later process;

主要參數 Main Parameters:

實例效果 Sample Effect:

【2D檢測效果】

【2D量測效果】

【3D檢測效果】